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    The effects of Cr oxidation and polyimide degradation on interface adhesion strength in Cu/Cr/polyimide flexible films

    New search for: Miyamura, T.
    New search for: Koike, J.

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    The effects of Cr oxidation and polyimide degradation on interface adhesion strength in Cu/Cr/polyimide flexible films

    New search for: Miyamura, T.
    New search for: Koike, J.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    The effects of Cr oxidation and polyimide degradation on interface adhesion strength in Cu/Cr/polyimide flexible films

    New search for: Miyamura, T.
    New search for: Koike, J.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

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    Document information
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    Document information
    Title:

    The effects of Cr oxidation and polyimide degradation on interface adhesion strength in Cu/Cr/polyimide flexible films

    Contributors:

    Miyamura, T. (author) / Koike, J. (author)

    Published in:

    MATERIALS SCIENCE AND ENGINEERING A ; 445-446 ; 620-624

    Publication date:

    2007-01-01

    Size:

    5 pages

    ISSN:

    0921-5093

    Type of media:

    Article (Journal)

    Type of material:

    Print

    Language:

    English

    Classification:

    DDC:  620.11

    © Metadata Copyright the British Library Board and other contributors. All rights reserved.

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