Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Dissolution and interfacial reactions of Fe in molten Sn-Cu and Sn-Pb solders
Dissolution and interfacial reactions of Fe in molten Sn-Cu and Sn-Pb solders
Dissolution and interfacial reactions of Fe in molten Sn-Cu and Sn-Pb solders
Huang, Y.-c. (Autor:in) / Chen, S.-w. (Autor:in) / Gierlotka, W. (Autor:in) / Chang, C.-h. (Autor:in) / Wu, J.-c. (Autor:in)
JOURNAL OF MATERIALS RESEARCH -PITTSBURGH THEN WARRENDALE- ; 22 ; 2924-2929
01.01.2007
6 pages
Aufsatz (Zeitschrift)
Englisch
DDC:
620.11
© Metadata Copyright the British Library Board and other contributors. All rights reserved.
High Dissolution Rate of Solid Materials in Molten Lead-Free Solders
| British Library Online Contents | 2008
Interfacial Reaction and Morphology Between Molten Sn Base Solders and Cu Substrate
| British Library Online Contents | 2004
Interfacial reactions between lead-free solders and common base materials
| British Library Online Contents | 2005
Interfacial reactions between Sn-Cu solders and Ni-Co alloys at 250 ^oC
| British Library Online Contents | 2010
Interfacial reactions between lead-free solders and the multilayer Au/Ni/SUS304 substrate
| British Library Online Contents | 2009