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Interfacial Reaction and Morphology Between Molten Sn Base Solders and Cu Substrate
Interfacial Reaction and Morphology Between Molten Sn Base Solders and Cu Substrate
Interfacial Reaction and Morphology Between Molten Sn Base Solders and Cu Substrate
Takaku, Y. (Autor:in) / Liu, X. J. (Autor:in) / Ohnuma, I. (Autor:in) / Kainuma, R. (Autor:in) / Ishida, K. (Autor:in)
MATERIALS TRANSACTIONS ; 45 ; 646-651
01.01.2004
6 pages
Aufsatz (Zeitschrift)
Englisch
DDC:
620.11
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