Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Interfacial microstructure, shear strength and electrical conductivity of Sn-3.5Ag-0.5In/Cu lead free soldered joints
Interfacial microstructure, shear strength and electrical conductivity of Sn-3.5Ag-0.5In/Cu lead free soldered joints
Interfacial microstructure, shear strength and electrical conductivity of Sn-3.5Ag-0.5In/Cu lead free soldered joints
Kar, A. (Autor:in) / Ghosh, M. (Autor:in) / Majumdar, B.S. (Autor:in) / Ghosh, R.N. (Autor:in) / Ray, A.K. (Autor:in)
MATERIALS TECHNOLOGY ; 22 ; 161-165
01.01.2007
5 pages
Aufsatz (Zeitschrift)
Englisch
DDC:
620.11
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