Low-Temperature Sintering of Nanoscale Silver Paste for Large-Area Joints in Power Electronics Modules: Fid-Bau Portal

Low-Temperature Sintering of Nanoscale Silver Paste for Large-Area Joints in Power Electronics Modules

Lei, T.G. / Calata, J. / Luo, S.F. / Lu, G.Q. / Chen, X.

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Low-Temperature Sintering of Nanoscale Silver Paste for Large-Area Joints in Power Electronics Modules

Lei, T.G. / Calata, J. / Luo, S.F. / Lu, G.Q. / Chen, X.

Low-Temperature Sintering of Nanoscale Silver Paste for Large-Area Joints in Power Electronics Modules

Lei, T.G. / Calata, J. / Luo, S.F. / Lu, G.Q. / Chen, X.

Zugriff

Zugriff über TIB

Verfügbarkeit in meiner Bibliothek prüfen

Bestellung bei Subito €

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Titel:

Low-Temperature Sintering of Nanoscale Silver Paste for Large-Area Joints in Power Electronics Modules

Beteiligte:

Lei, T.G. (Autor:in) / Calata, J. (Autor:in) / Luo, S.F. (Autor:in) / Lu, G.Q. (Autor:in) / Chen, X. (Autor:in) / Zhou, Y. / Tu, S.-T. / Xie, X.

Erschienen in:

Progresses in Fracture and Strength of Materials and Structures: Part 4: Selected, peer reviewed papers from the Asian Pacific Conference Fracture and Strength 2006 (APCFS'06), held at Sanya, Hainan Island, China during November 22˜25, 2006 ; 2948-2953

KEY ENGINEERING MATERIALS ; 353/358

Erscheinungsdatum:

01.01.2007

Format / Umfang:

6 pages

ISSN:

1013-9826

Medientyp:

Aufsatz (Zeitschrift)

Format:

Sprache:

Englisch

Klassifikation:

DDC: 620.11

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