Fachinformationsdienst BAUdigital

A platform for research: civil engineering, architecture and urbanism

    Low-Temperature Sintering of Nanoscale Silver Paste for Large-Area Joints in Power Electronics Modules

    New search for: Lei, T.G.
    New search for: Calata, J.
    New search for: Luo, S.F.
    New search for: Lu, G.Q.
    New search for: Chen, X.
    New search for: Zhou, Y.
    New search for: Tu, S.-T.
    New search for: Xie, X.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Page navigation

    Document information
    Similar titles

    Export, share and cite

    Low-Temperature Sintering of Nanoscale Silver Paste for Large-Area Joints in Power Electronics Modules

    New search for: Lei, T.G.
    New search for: Calata, J.
    New search for: Luo, S.F.
    New search for: Lu, G.Q.
    New search for: Chen, X.
    New search for: Zhou, Y.
    New search for: Tu, S.-T.
    New search for: Xie, X.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Low-Temperature Sintering of Nanoscale Silver Paste for Large-Area Joints in Power Electronics Modules

    New search for: Lei, T.G.
    New search for: Calata, J.
    New search for: Luo, S.F.
    New search for: Lu, G.Q.
    New search for: Chen, X.
    New search for: Zhou, Y.
    New search for: Tu, S.-T.
    New search for: Xie, X.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Page navigation

    Document information
    Similar titles

    Export, share and cite

    Document information
    Title:

    Low-Temperature Sintering of Nanoscale Silver Paste for Large-Area Joints in Power Electronics Modules

    Contributors:

    Lei, T.G. (author) / Calata, J. (author) / Luo, S.F. (author) / Lu, G.Q. (author) / Chen, X. (author) / Zhou, Y. / Tu, S.-T. / Xie, X.

    Published in:

    Progresses in Fracture and Strength of Materials and Structures: Part 4: Selected, peer reviewed papers from the Asian Pacific Conference Fracture and Strength 2006 (APCFS'06), held at Sanya, Hainan Island, China during November 22˜25, 2006 ; 2948-2953

    KEY ENGINEERING MATERIALS ; 353/358

    Publication date:

    2007-01-01

    Size:

    6 pages

    ISSN:

    1013-9826

    Type of media:

    Article (Journal)

    Type of material:

    Print

    Language:

    English

    Classification:

    DDC:  620.11

    © Metadata Copyright the British Library Board and other contributors. All rights reserved.

    Similar titles

    Applying Anand model to low-temperature sintered nanoscale silver paste chip attachment

    Yu, D. j. / Chen, X. / Chen, G. et al. | British Library Online Contents | 2009

    Pressureless sintering of nanosilver paste at low temperature to join large area (≥100mm2) power chips for electronic packaging

    Fu, S. / Mei, Y. / Lu, G. Q. et al. | British Library Online Contents | 2014

    Fabrication of large-area interconnects by sintering of micron Ag paste

    Fu, Shan-Can / Zhao, Man / Shan, Huiyong et al. | British Library Online Contents | 2018

    Fabrication of large-area interconnects by sintering of micron Ag paste

    Fu, Shan-Can / Zhao, Man / Shan, Huiyong et al. | British Library Online Contents | 2018

    Enhanced pressureless bonding by Tin Doped Silver Paste at low sintering temperature

    Yang, Cheng-Xiang / Li, Xin / Lu, Guo-Quan et al. | British Library Online Contents | 2016

    Back to top