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Characteristics in chemical-mechanical polishing of copper: comparison of polishing pads
Characteristics in chemical-mechanical polishing of copper: comparison of polishing pads
Characteristics in chemical-mechanical polishing of copper: comparison of polishing pads
Stavreva, Z. (Autor:in) / Zeidler, D. (Autor:in) / Ploetner, M. (Autor:in) / Drescher, K. (Autor:in)
APPLIED SURFACE SCIENCE ; 108 ; 39-44
01.01.1997
6 pages
Aufsatz (Zeitschrift)
Englisch
DDC:
621.35
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