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Chemical mechanical polishing of steel substrate using colloidal silica-based slurries

Jiang, L. / He, Y. / Luo, J. | British Library Online Contents | 2015

Corrosion Inhibiting Effect on Copper Chemical Mechanical Planarization (CMP) in Fe(NO~3)~3 Based Slurries

Guo, D. M. / Li, X. J. / Jin, Z. J. et al. | British Library Online Contents | 2005

Environment friendly chemical mechanical polishing of copper

Zhang, Zhenyu / Cui, Junfeng / Zhang, Jiabo et al. | British Library Online Contents | 2019

Characteristics in chemical-mechanical polishing of copper: comparison of polishing pads

Stavreva, Z. / Zeidler, D. / Ploetner, M. et al. | British Library Online Contents | 1997