Effects of kinematic forms on material removal rate and non-uniformity in chemical mechanical planarisation

Wang, C.L. / Jin, Z.J. / Kang, R.K. | British Library Online Contents | 2008

Influence of surfactant and salts on chemical mechanical planarisation of copper

Bernard, P. / Kapsa, P. / Coude, T. et al. | British Library Online Contents | 2005

A comprehensive review of endpoint detection in chemical mechanical planarisation for deep-submicron integrated circuits manufacturing

Hocheng, H. / Huang, Y.-L. | British Library Online Contents | 2003

Anodic dissolution of copper in dilute hydroxylamine solutions: application to electrochemical mechanical planarisation of copper

Muthukumaran, A. / Venkataraman, N. / Tamilmani, S. et al. | British Library Online Contents | 2009

A Method to Improve Uniformity of Material Removal of Chemical Mechanical Polishing in LCOS Process

Sun, Y.H. / Kang, R.K. / Guo, D.M. | British Library Online Contents | 2008