Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Solderability of Electrodeposited Fe-Ni Alloys with Eutectic SnAgCu Solder
Solderability of Electrodeposited Fe-Ni Alloys with Eutectic SnAgCu Solder
Solderability of Electrodeposited Fe-Ni Alloys with Eutectic SnAgCu Solder
Guo, J. (Autor:in) / Zhang, L. (Autor:in) / Xian, A. (Autor:in) / Shang, J.K. (Autor:in)
JOURNAL OF MATERIALS SCIENCE AND TECHNOLOGY -SHENYANG- ; 23 ; 811-816
01.01.2007
6 pages
Aufsatz (Zeitschrift)
Englisch
DDC:
620.11
© Metadata Copyright the British Library Board and other contributors. All rights reserved.
Electromigration behaviors in Sb particle-reinforced composite eutectic SnAgCu solder joints
| British Library Online Contents | 2009
Interfacial microstructure evolution between eutectic SnAgCu solder and Al/Ni(V)/Cu thin films
| British Library Online Contents | 2002
Recrystallization behaviour of SnAgCu solder joints
| British Library Online Contents | 2008
Electrochemical Corrosion Behavior of SnAgCu and SnPb Solder Alloys in Solution with Activator
| British Library Online Contents | 2010
Mechanical and microstructural properties of SnAgCu solder joints
| British Library Online Contents | 2006