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    Effects of microstructure on the formation, shape, and motion of voids during electromigration in passivated copper interconnects

    New search for: Choi, Z.-S.
    New search for: Monig, R.
    New search for: Thompson, C.V.

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    Effects of microstructure on the formation, shape, and motion of voids during electromigration in passivated copper interconnects

    New search for: Choi, Z.-S.
    New search for: Monig, R.
    New search for: Thompson, C.V.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Effects of microstructure on the formation, shape, and motion of voids during electromigration in passivated copper interconnects

    New search for: Choi, Z.-S.
    New search for: Monig, R.
    New search for: Thompson, C.V.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Page navigation

    Document information
    Similar titles

    Export, share and cite

    Document information
    Title:

    Effects of microstructure on the formation, shape, and motion of voids during electromigration in passivated copper interconnects

    Contributors:

    Choi, Z.-S. (author) / Monig, R. (author) / Thompson, C.V. (author)

    Published in:

    JOURNAL OF MATERIALS RESEARCH -PITTSBURGH THEN WARRENDALE- ; 23 ; 383-391

    Publication date:

    2008-01-01

    Size:

    9 pages

    ISSN:

    0884-2914

    Type of media:

    Article (Journal)

    Type of material:

    Print

    Language:

    English

    Classification:

    DDC:  620.11

    © Metadata Copyright the British Library Board and other contributors. All rights reserved.

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