Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Comparison of Impact Properties of Sn-9Zn and Sn-3Ag-0.5Cu Lead-Free Solder Ball Joints
Comparison of Impact Properties of Sn-9Zn and Sn-3Ag-0.5Cu Lead-Free Solder Ball Joints
Comparison of Impact Properties of Sn-9Zn and Sn-3Ag-0.5Cu Lead-Free Solder Ball Joints
Shohji, I. (Autor:in) / Shimoyama, S. (Autor:in) / Ishikawa, H. (Autor:in) / Kojima, M. (Autor:in)
KEY ENGINEERING MATERIALS ; 385/387 ; 429-432
01.01.2008
4 pages
Aufsatz (Zeitschrift)
Englisch
DDC:
620.11
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