Comparison of Impact Properties of Sn-9Zn and Sn-3Ag-0.5Cu Lead-Free Solder Ball Joints: Fid-Bau Portal

Comparison of Impact Properties of Sn-9Zn and Sn-3Ag-0.5Cu Lead-Free Solder Ball Joints

Shohji, I. / Shimoyama, S. / Ishikawa, H. / Kojima, M.

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Comparison of Impact Properties of Sn-9Zn and Sn-3Ag-0.5Cu Lead-Free Solder Ball Joints

Shohji, I. / Shimoyama, S. / Ishikawa, H. / Kojima, M.

Comparison of Impact Properties of Sn-9Zn and Sn-3Ag-0.5Cu Lead-Free Solder Ball Joints

Shohji, I. / Shimoyama, S. / Ishikawa, H. / Kojima, M.

Access

Access via TIB

Check availability in my library

Order at Subito €

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Document information

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Document information

Title:

Comparison of Impact Properties of Sn-9Zn and Sn-3Ag-0.5Cu Lead-Free Solder Ball Joints

Contributors:

Shohji, I. (author) / Shimoyama, S. (author) / Ishikawa, H. (author) / Kojima, M. (author)

Published in:

KEY ENGINEERING MATERIALS ; 385/387 ; 429-432

Publication date:

2008-01-01

Size:

4 pages

ISSN:

1013-9826

Type of media:

Article (Journal)

Type of material:

Language:

English

Classification:

DDC: 620.11

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