Effect of minor addition of Pb upon interfacial reactions and mechanical properties at Sn-3.0Ag-0.5Cu/Cu and Sn-58Bi/Cu solder joints: Fid-Bau Portal

Effect of minor addition of Pb upon interfacial reactions and mechanical properties at Sn-3.0Ag-0.5Cu/Cu and Sn-58Bi/Cu solder joints

Yen, Y.-W. / Chou, W.-T. / Chen, H.-C. / Liou, W.-K. / Lee, C.

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Effect of minor addition of Pb upon interfacial reactions and mechanical properties at Sn-3.0Ag-0.5Cu/Cu and Sn-58Bi/Cu solder joints

Yen, Y.-W. / Chou, W.-T. / Chen, H.-C. / Liou, W.-K. / Lee, C.

Effect of minor addition of Pb upon interfacial reactions and mechanical properties at Sn-3.0Ag-0.5Cu/Cu and Sn-58Bi/Cu solder joints

Yen, Y.-W. / Chou, W.-T. / Chen, H.-C. / Liou, W.-K. / Lee, C.

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Zugriff über TIB

Verfügbarkeit in meiner Bibliothek prüfen

Bestellung bei Subito €

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Titel:

Effect of minor addition of Pb upon interfacial reactions and mechanical properties at Sn-3.0Ag-0.5Cu/Cu and Sn-58Bi/Cu solder joints

Beteiligte:

Yen, Y.-W. (Autor:in) / Chou, W.-T. (Autor:in) / Chen, H.-C. (Autor:in) / Liou, W.-K. (Autor:in) / Lee, C. (Autor:in)

Erschienen in:

INTERNATIONAL JOURNAL OF MATERIALS RESEARCH ; 99 ; 1256-1261

Erscheinungsdatum:

01.01.2008

Format / Umfang:

6 pages

ISSN:

1862-5282

Medientyp:

Aufsatz (Zeitschrift)

Format:

Sprache:

Englisch

Klassifikation:

DDC: 669.9

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