Effect of minor addition of Pb upon interfacial reactions and mechanical properties at Sn-3.0Ag-0.5Cu/Cu and Sn-58Bi/Cu solder joints: Fid-Bau Portal

Effect of minor addition of Pb upon interfacial reactions and mechanical properties at Sn-3.0Ag-0.5Cu/Cu and Sn-58Bi/Cu solder joints

Yen, Y.-W. / Chou, W.-T. / Chen, H.-C. / Liou, W.-K. / Lee, C.

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Effect of minor addition of Pb upon interfacial reactions and mechanical properties at Sn-3.0Ag-0.5Cu/Cu and Sn-58Bi/Cu solder joints

Yen, Y.-W. / Chou, W.-T. / Chen, H.-C. / Liou, W.-K. / Lee, C.

Effect of minor addition of Pb upon interfacial reactions and mechanical properties at Sn-3.0Ag-0.5Cu/Cu and Sn-58Bi/Cu solder joints

Yen, Y.-W. / Chou, W.-T. / Chen, H.-C. / Liou, W.-K. / Lee, C.

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Check availability in my library

Order at Subito €

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Document information

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Title:

Effect of minor addition of Pb upon interfacial reactions and mechanical properties at Sn-3.0Ag-0.5Cu/Cu and Sn-58Bi/Cu solder joints

Contributors:

Yen, Y.-W. (author) / Chou, W.-T. (author) / Chen, H.-C. (author) / Liou, W.-K. (author) / Lee, C. (author)

Published in:

INTERNATIONAL JOURNAL OF MATERIALS RESEARCH ; 99 ; 1256-1261

Publication date:

2008-01-01

Size:

6 pages

ISSN:

1862-5282

Type of media:

Article (Journal)

Type of material:

Language:

English

Classification:

DDC: 669.9

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