Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Material Removal Mechanism of Chemo-Mechanical Grinding (CMG) of Si Wafer by Using Soft Abrasive Grinding Wheel (SAGW)
Material Removal Mechanism of Chemo-Mechanical Grinding (CMG) of Si Wafer by Using Soft Abrasive Grinding Wheel (SAGW)
Material Removal Mechanism of Chemo-Mechanical Grinding (CMG) of Si Wafer by Using Soft Abrasive Grinding Wheel (SAGW)
Guo, D.M. (Autor:in) / Tian, Y.B. (Autor:in) / Kang, R.K. (Autor:in) / Zhou, L.B. (Autor:in) / Lei, M.K. (Autor:in)
KEY ENGINEERING MATERIALS ; 389/390 ; 459-464
01.01.2009
6 pages
Aufsatz (Zeitschrift)
Englisch
DDC:
620.11
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