Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Surface integrity and removal mechanism of silicon wafers in chemo-mechanical grinding using a newly developed soft abrasive grinding wheel
Surface integrity and removal mechanism of silicon wafers in chemo-mechanical grinding using a newly developed soft abrasive grinding wheel
Surface integrity and removal mechanism of silicon wafers in chemo-mechanical grinding using a newly developed soft abrasive grinding wheel
Gao, Shang (Autor:in) / Huang, Han (Autor:in) / Zhu, Xianglong (Autor:in) / Kang, Renke (Autor:in)
Materials science in semiconductor processing ; 63 ; 97-106
01.01.2017
10 pages
Aufsatz (Zeitschrift)
Englisch
DDC:
621.38152
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