A platform for research: civil engineering, architecture and urbanism
A platform for research: civil engineering, architecture and urbanism
Material Removal Mechanism of Chemo-Mechanical Grinding (CMG) of Si Wafer by Using Soft Abrasive Grinding Wheel (SAGW)
Material Removal Mechanism of Chemo-Mechanical Grinding (CMG) of Si Wafer by Using Soft Abrasive Grinding Wheel (SAGW)
Material Removal Mechanism of Chemo-Mechanical Grinding (CMG) of Si Wafer by Using Soft Abrasive Grinding Wheel (SAGW)
Guo, D.M. (author) / Tian, Y.B. (author) / Kang, R.K. (author) / Zhou, L.B. (author) / Lei, M.K. (author)
KEY ENGINEERING MATERIALS ; 389/390 ; 459-464
2009-01-01
6 pages
Article (Journal)
English
DDC:
620.11
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