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Spalling of intermetallic compounds during the reaction between lead-free solders and electroless Ni-P metallization
Spalling of intermetallic compounds during the reaction between lead-free solders and electroless Ni-P metallization
Spalling of intermetallic compounds during the reaction between lead-free solders and electroless Ni-P metallization
Sohn, Y. C. (Autor:in) / Yu, J. (Autor:in) / Kang, S. K. (Autor:in) / Shih, D. Y. (Autor:in) / Lee, T. Y. (Autor:in)
JOURNAL OF MATERIALS RESEARCH -PITTSBURGH THEN WARRENDALE- ; 19 ; 2428-2436
01.01.2004
9 pages
Aufsatz (Zeitschrift)
Englisch
DDC:
620.11
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