Effects of Nano-TiO2 additions on thermal analysis, microstructure and tensile properties of Sn3.5Ag0.25Cu solder

Tsao, L.C. / Chang, S.Y. | Elsevier | 2009

Effects of nano-Al2O3 additions on microstructure development and hardness of Sn3.5Ag0.5Cu solder

Tsao, L. C. / Chang, S. Y. / Lee, C. I. et al. | British Library Online Contents | 2010

Cu and Ag additions affecting the solidification microstructure and tensile properties of Sn-Bi lead-free solder alloys

Silva, Bismarck L. / Xavier, Marcella G.C. / Garcia, Amauri et al. | British Library Online Contents | 2017

Effects of nano-Al2O3 additions on microstructure development and hardness of Sn3.5Ag0.5Cu solder

Tsao, L.C. / Chang, S.Y. / Lee, C.I. et al. | Elsevier | 2010

Correlation between mechanical tensile properties and microstructure of eutectic Sn-3.5Ag solder

Yeung, B. / Jang, J. W. | British Library Online Contents | 2002