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Effects of nano-Al2O3 additions on microstructure development and hardness of Sn3.5Ag0.5Cu solder
Effects of nano-Al2O3 additions on microstructure development and hardness of Sn3.5Ag0.5Cu solder
Effects of nano-Al2O3 additions on microstructure development and hardness of Sn3.5Ag0.5Cu solder
Tsao, L. C. (Autor:in) / Chang, S. Y. (Autor:in) / Lee, C. I. (Autor:in) / Sun, W. H. (Autor:in) / Huang, C. H. (Autor:in)
MATERIALS AND DESIGN -REIGATE- ; 31 ; 4831-4835
01.01.2010
5 pages
Aufsatz (Zeitschrift)
Englisch
DDC:
620.0042
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