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    Effects of Nano-TiO2 additions on thermal analysis, microstructure and tensile properties of Sn3.5Ag0.25Cu solder

    New search for: Tsao, L. C.
    New search for: Chang, S. Y.

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    Effects of Nano-TiO2 additions on thermal analysis, microstructure and tensile properties of Sn3.5Ag0.25Cu solder

    New search for: Tsao, L. C.
    New search for: Chang, S. Y.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Effects of Nano-TiO2 additions on thermal analysis, microstructure and tensile properties of Sn3.5Ag0.25Cu solder

    New search for: Tsao, L. C.
    New search for: Chang, S. Y.

    Access

    Access via TIB
    Check availability in my library
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    Document information
    Title:

    Effects of Nano-TiO2 additions on thermal analysis, microstructure and tensile properties of Sn3.5Ag0.25Cu solder

    Contributors:

    Tsao, L. C. (author) / Chang, S. Y. (author)

    Published in:

    MATERIALS AND DESIGN -REIGATE- ; 31 ; 990-993

    Publication date:

    2010-01-01

    Size:

    4 pages

    ISSN:

    0264-1275

    Type of media:

    Article (Journal)

    Type of material:

    Print

    Language:

    English

    Classification:

    DDC:  620.0042

    © Metadata Copyright the British Library Board and other contributors. All rights reserved.

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