Formation of interfacial eta '-Cu~6Sn~5 in Sn-0.7Cu/Cu solder joints during isothermal aging

Luo, Z. / Wang, L. / Fu, Q. et al. | British Library Online Contents | 2011

Diamond Brazing - Interfacial Reactions and Wetting

Tillmann, W. / Osmanda, A. M. / Yurchenko, S. et al. | British Library Online Contents | 2005

Non-interfacial growth of Cu3Sn in Cu/Sn/Cu joints during ultrasonic-assisted transient liquid phase soldering process

Zhao, H.Y. / Liu, J.H. / Li, Z.L. et al. | British Library Online Contents | 2017

Wetting behavior of Co based active brazing alloys on SiC and the interfacial reactions

Xiong, H. / Li, X. / Mao, W. et al. | British Library Online Contents | 2003

Growth Kinetics of Intermetallic Compound and Interfacial Reactions in Pb-Free Flip Chip Solder Bump during Solid State Isothermal Aging

Kim, D. G. / Jang, H. S. / Kim, Y. J. et al. | British Library Online Contents | 2005