Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Non-interfacial growth of Cu3Sn in Cu/Sn/Cu joints during ultrasonic-assisted transient liquid phase soldering process
Non-interfacial growth of Cu3Sn in Cu/Sn/Cu joints during ultrasonic-assisted transient liquid phase soldering process
Non-interfacial growth of Cu3Sn in Cu/Sn/Cu joints during ultrasonic-assisted transient liquid phase soldering process
Zhao, H.Y. (Autor:in) / Liu, J.H. (Autor:in) / Li, Z.L. (Autor:in) / Zhao, Y.X. (Autor:in) / Niu, H.W. (Autor:in) / Song, X.G. (Autor:in) / Dong, H.J. (Autor:in)
MATERIALS LETTERS ; 186 ; 283-288
01.01.2017
6 pages
Aufsatz (Zeitschrift)
Unbekannt
© Metadata Copyright the British Library Board and other contributors. All rights reserved.
Current stressing-induced growth of Cu3Sn in Cu/Sn/Cu solder joints
British Library Online Contents | 2011
|Formation mechanism and orientation of Cu3Sn grains in Cu–Sn intermetallic compound joints
British Library Online Contents | 2013
|British Library Online Contents | 2011
|Preparation and characterization of Cu3Sn nanoparticles via a facile ultrasonic irradiation
British Library Online Contents | 2012
|British Library Online Contents | 2016
|