Growth Kinetics of Intermetallic Compound and Interfacial Reactions in Pb-Free Flip Chip Solder Bump during Solid State Isothermal Aging: Fid-Bau Portal

Growth Kinetics of Intermetallic Compound and Interfacial Reactions in Pb-Free Flip Chip Solder Bump during Solid State Isothermal Aging

Kim, D. G. / Jang, H. S. / Kim, Y. J. / Jung, S. B.

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Growth Kinetics of Intermetallic Compound and Interfacial Reactions in Pb-Free Flip Chip Solder Bump during Solid State Isothermal Aging

Kim, D. G. / Jang, H. S. / Kim, Y. J. / Jung, S. B.

Growth Kinetics of Intermetallic Compound and Interfacial Reactions in Pb-Free Flip Chip Solder Bump during Solid State Isothermal Aging

Kim, D. G. / Jang, H. S. / Kim, Y. J. / Jung, S. B.

Zugriff

Zugriff über TIB

Verfügbarkeit in meiner Bibliothek prüfen

Bestellung bei Subito €

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Ähnliche Titel

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Dokumentinformationen

Titel:

Growth Kinetics of Intermetallic Compound and Interfacial Reactions in Pb-Free Flip Chip Solder Bump during Solid State Isothermal Aging

Beteiligte:

Kim, D. G. (Autor:in) / Jang, H. S. (Autor:in) / Kim, Y. J. (Autor:in) / Jung, S. B. (Autor:in) / Kim, H. S. / Park, S.-Y. / Hur, B. Y. / Lee, S. W.

Erschienen in:

Eco-Materials Processing & Design VI ; 273-276

MATERIALS SCIENCE FORUM ; 486/487

Erscheinungsdatum:

01.01.2005

Format / Umfang:

4 pages

ISSN:

0255-5476

Medientyp:

Aufsatz (Zeitschrift)

Format:

Sprache:

Englisch

Klassifikation:

DDC: 620.11

Kim, D.-G. / Jung, S.-B. | British Library Online Contents | 2005

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Electromigration Effects upon Interfacial Reactions in Flip-Chip Solder Joints

Chen, S.-w. / Lin, S.-k. / Jao, J.-m. | British Library Online Contents | 2004

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