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Morphology Improvement of Step Bunching on 4H-SiC Wafers by Polishing Technique
Morphology Improvement of Step Bunching on 4H-SiC Wafers by Polishing Technique
Morphology Improvement of Step Bunching on 4H-SiC Wafers by Polishing Technique
Kato, T. (Autor:in) / Kinoshita, A. (Autor:in) / Wada, K. (Autor:in) / Nishi, T. (Autor:in) / Hozomi, E. (Autor:in) / Taniguchi, H. (Autor:in) / Fukuda, K. (Autor:in) / Okumura, H. (Autor:in) / Bauer, A.J. / Friedrichs, P.
01.01.2010
4 pages
Aufsatz (Zeitschrift)
Englisch
DDC:
620.11
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