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Simulation of the creep damage behavior of thin film/substrate systems by bending creep tests
Simulation of the creep damage behavior of thin film/substrate systems by bending creep tests
Simulation of the creep damage behavior of thin film/substrate systems by bending creep tests
Wen, S. F. (author) / Yan, W. Z. (author) / Kang, J. X. (author) / Liu, J. (author) / Yue, Z. F. (author)
MATERIALS AND DESIGN -REIGATE- ; 31 ; 3531-3536
2010-01-01
6 pages
Article (Journal)
English
DDC:
620.0042
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