Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Electromigration-induced strain relaxation in Cu conductor lines
Electromigration-induced strain relaxation in Cu conductor lines
Electromigration-induced strain relaxation in Cu conductor lines
Zhang, H. (Autor:in) / Cargill, G.S. (Autor:in)
JOURNAL OF MATERIALS RESEARCH -PITTSBURGH THEN WARRENDALE- ; 26 ; 498-502
01.01.2011
5 pages
Aufsatz (Zeitschrift)
Englisch
DDC:
620.11
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