Creep behavior of near-peritectic Sn-5Sb solders containing small amount of Ag and Cu: Fid-Bau Portal

Creep behavior of near-peritectic Sn-5Sb solders containing small amount of Ag and Cu

El-Daly, A. A. / Mohamad, A. Z. / Fawzy, A. / El-Taher, A. M.

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Creep behavior of near-peritectic Sn-5Sb solders containing small amount of Ag and Cu

El-Daly, A. A. / Mohamad, A. Z. / Fawzy, A. / El-Taher, A. M.

Creep behavior of near-peritectic Sn-5Sb solders containing small amount of Ag and Cu

El-Daly, A. A. / Mohamad, A. Z. / Fawzy, A. / El-Taher, A. M.

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Access via TIB

Check availability in my library

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Document information

Title:

Creep behavior of near-peritectic Sn-5Sb solders containing small amount of Ag and Cu

Contributors:

El-Daly, A. A. (author) / Mohamad, A. Z. (author) / Fawzy, A. (author) / El-Taher, A. M. (author)

Published in:

MATERIALS SCIENCE AND ENGINEERING A ; 528 ; 1055-1062

Publication date:

2011-01-01

Size:

8 pages

ISSN:

0921-5093

Type of media:

Article (Journal)

Type of material:

Language:

English

Classification:

DDC: 620.11

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