Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Thickness Effect on Microstructure and Residual Stress of Annealed Copper Thin Films
Thickness Effect on Microstructure and Residual Stress of Annealed Copper Thin Films
Thickness Effect on Microstructure and Residual Stress of Annealed Copper Thin Films
Vayrette, R. (Autor:in) / Rivero, C. (Autor:in) / Blayac, S. (Autor:in) / Inal, K. (Autor:in) / Scardi, P. / Ricardo, C.L.A.
01.01.2011
6 pages
Aufsatz (Zeitschrift)
Englisch
DDC:
620.11
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