Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Electrochemical behavior of a lead-free SnAg solder alloy affected by the microstructure array
Electrochemical behavior of a lead-free SnAg solder alloy affected by the microstructure array
Electrochemical behavior of a lead-free SnAg solder alloy affected by the microstructure array
Osorio, W.R. (Autor:in) / Garcia, L.R. (Autor:in) / Peixoto, L.C. (Autor:in) / Garcia, A. (Autor:in)
MATERIALS AND DESIGN -REIGATE- ; 32 ; 4763-4772
01.01.2011
10 pages
Aufsatz (Zeitschrift)
Englisch
DDC:
620.0042
© Metadata Copyright the British Library Board and other contributors. All rights reserved.
Microstructural evolution during electromigration in eutectic SnAg solder bumps
British Library Online Contents | 2005
|Electrochemical behavior of a lead-free Sn-Cu solder alloy in NaCl solution
British Library Online Contents | 2014
|Microstructure and tensile behavior of Sn-5Sb lead-free solder alloy containing Bi and Cu
British Library Online Contents | 2011
|Impression creep behavior of lead-free Sn-5Sb solder alloy
British Library Online Contents | 2007
|