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Microstructural evolution during electromigration in eutectic SnAg solder bumps

Chen, Y. H. / Shao, T. L. / Liu, P. C. / Chen, C. / Chou, T.

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Microstructural evolution during electromigration in eutectic SnAg solder bumps

Chen, Y. H. / Shao, T. L. / Liu, P. C. / Chen, C. / Chou, T.

Microstructural evolution during electromigration in eutectic SnAg solder bumps

Chen, Y. H. / Shao, T. L. / Liu, P. C. / Chen, C. / Chou, T.

Zugriff

Zugriff über TIB

Verfügbarkeit in meiner Bibliothek prüfen

Bestellung bei Subito €

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Ähnliche Titel

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Titel:

Microstructural evolution during electromigration in eutectic SnAg solder bumps

Beteiligte:

Chen, Y. H. (Autor:in) / Shao, T. L. (Autor:in) / Liu, P. C. (Autor:in) / Chen, C. (Autor:in) / Chou, T. (Autor:in)

Erschienen in:

JOURNAL OF MATERIALS RESEARCH -PITTSBURGH THEN WARRENDALE- ; 20 ; 2432-2442

Erscheinungsdatum:

01.01.2005

Format / Umfang:

11 pages

ISSN:

0884-2914

Medientyp:

Aufsatz (Zeitschrift)

Format:

Sprache:

Englisch

Klassifikation:

DDC: 620.11

Lu, C. M. / Shao, T. L. / Yang, C. J. et al. | British Library Online Contents | 2004

Damages and microstructural variation of high-lead and eutectic SnPb composite flip chip solder bumps induced by electromigration

Liu, Y.-H. / Lin, K.-L. | British Library Online Contents | 2005

Measurement of electromigration activation energy in eutectic SnPb and SnAg flip-chip solder joints with Cu and Ni under-bump metallization

Chen, H.-Y. / Chen, C. | British Library Online Contents | 2010

Thermomigration of Cu-Sn and Ni-Sn intermetallic compounds during electromigration in Pb-free SnAg solder joints

Chen, H.-Y. / Chen, C. | British Library Online Contents | 2011

Electromigration at the high-Pb-eutectic SnPb solder interface

Lai, C. L. / Lin, C. H. / Chen, C. | British Library Online Contents | 2004

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