Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Correlation between Strain and Excess Carrier Lifetime in a 3C-SiC Wafer
Correlation between Strain and Excess Carrier Lifetime in a 3C-SiC Wafer
Correlation between Strain and Excess Carrier Lifetime in a 3C-SiC Wafer
Yoshida, A. (Autor:in) / Kato, M. (Autor:in) / Ichimura, M. (Autor:in)
MATERIALS SCIENCE FORUM ; 717/720 ; 305-308
01.01.2012
4 pages
Aufsatz (Zeitschrift)
Englisch
DDC:
620.11
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