Effects of small amount of active Ti element additions on microstructure and property of Sn3.5Ag0.5Cu solder

Chuang, C.L. / Tsao, L.C. / Lin, H.K. et al. | British Library Online Contents | 2012

Effects of nano-Al2O3 additions on microstructure development and hardness of Sn3.5Ag0.5Cu solder

Tsao, L.C. / Chang, S.Y. / Lee, C.I. et al. | Elsevier | 2010

Characteristics of Laser Reflow Bumping of Sn3.5Ag and Sn3.5Ag0.5Cu Lead-Free Solder Balls

Tian, Y. / Wang, C. / Chen, Y. | British Library Online Contents | 2008

Effects of Small Amount Addition of Rare Earth Y on Microstructure and Property of Sn3.0Ag0.5Cu Solder

Li, H. | British Library Online Contents | 2014

Effects of nano-Al2O3 particles on microstructure and mechanical properties of Sn3.5Ag0.5Cu composite solder ball grid array joints on Sn/Cu pads

Tsao, L.C. / Wu, R.W. / Cheng, T.-H. et al. | British Library Online Contents | 2013