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Effects of Small Amount Addition of Rare Earth Y on Microstructure and Property of Sn3.0Ag0.5Cu Solder
01.01.2014
6 pages
Aufsatz (Zeitschrift)
Englisch
DDC:
620.11
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R-curve behavior of Cu-Sn3.0Ag0.5Cu solder joints: Effect of mode ratio and microstructure
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