A platform for research: civil engineering, architecture and urbanism
A platform for research: civil engineering, architecture and urbanism
Properties Investigation on Chip-on-Film (COF) Thermosonic Bonding Using Anisotropic Conductive Films (ACFs)
Properties Investigation on Chip-on-Film (COF) Thermosonic Bonding Using Anisotropic Conductive Films (ACFs)
Properties Investigation on Chip-on-Film (COF) Thermosonic Bonding Using Anisotropic Conductive Films (ACFs)
Jeong, J.S. (author) / Yim, B.-S. (author) / Oh, S.H. (author) / Song, H. (author) / Lee, B.H. (author) / Kim, J.-M. (author)
MATERIALS TRANSACTIONS ; 53 ; 2097-2103
2012-01-01
7 pages
Article (Journal)
English
DDC:
620.11
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