Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Microstructures Variations of Sn-9Zn-1Al and Sn-8Zn-3Bi Solder Pastes with Sn-3.8Ag-0.7Cu Solder Balls on OSP PCBs after Thermal Cycling Test
Microstructures Variations of Sn-9Zn-1Al and Sn-8Zn-3Bi Solder Pastes with Sn-3.8Ag-0.7Cu Solder Balls on OSP PCBs after Thermal Cycling Test
Microstructures Variations of Sn-9Zn-1Al and Sn-8Zn-3Bi Solder Pastes with Sn-3.8Ag-0.7Cu Solder Balls on OSP PCBs after Thermal Cycling Test
Wang, M.-C. (Autor:in) / Lin, C.-T. (Autor:in) / Hsi, C.-S. (Autor:in) / Chang, T.-C. (Autor:in) / Liang, M.-K. (Autor:in) / Huang, H.-H. (Autor:in)
MATERIALS TRANSACTIONS ; 54 ; 332-336
01.01.2013
5 pages
Aufsatz (Zeitschrift)
Englisch
DDC:
620.11
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