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Novel SiC nanoparticles-containing Sn–1.0Ag–0.5Cu solder with good drop impact performance
Novel SiC nanoparticles-containing Sn–1.0Ag–0.5Cu solder with good drop impact performance
Novel SiC nanoparticles-containing Sn–1.0Ag–0.5Cu solder with good drop impact performance
El-Daly, A. A. (Autor:in) / Fawzy, A. (Autor:in) / Mansour, S. F. (Autor:in) / Younis, M. J. (Autor:in)
MATERIALS SCIENCE AND ENGINEERING A ; 578 ; 62-71
01.01.2013
10 pages
Aufsatz (Zeitschrift)
Englisch
DDC:
620.11
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Modification of Sn–1.0Ag–0.5Cu solder using nickel and boron
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