Structural characterization and creep resistance of nano-silicon carbide reinforced Sn–1.0Ag–0.5Cu lead-free solder alloy

El-Daly, A.A. / Al-Ganainy, G.S. / Fawzy, A. et al. | Elsevier | 2013

Modification of Sn–1.0Ag–0.5Cu solder using nickel and boron

Qu, J. F. / Xu, J. / Hu, Q. et al. | British Library Online Contents | 2015

Novel SiC nanoparticles-containing Sn–1.0Ag–0.5Cu solder with good drop impact performance

El-Daly, A. A. / Fawzy, A. / Mansour, S. F. et al. | British Library Online Contents | 2013

Microstructure, mechanical properties, and deformation behavior of Sn-1.0Ag-0.5Cu solder after Ni and Sb additions

El-Daly, A.A. / Hammad, A.E. / Fawzy, A. et al. | British Library Online Contents | 2012

Microstructure, mechanical properties, and deformation behavior of Sn–1.0Ag–0.5Cu solder after Ni and Sb additions

El-Daly, A.A. / Hammad, A.E. / Fawzy, A. et al. | Elsevier | 2012