Cu (II) as a Catalyst for Hydrogen Peroxide System Abrasive-Free Polishing on Hard Disk Substrate

Wang, Z.J. / Lei, H. / Zhang, W.T. et al. | British Library Online Contents | 2013

Chemical Mechanical Polishing of Computer Hard Disk Substrate in Colloidal SiO~2 Slurry

Lei, H. | British Library Online Contents | 2002

Fixed Abrasive Lapping and Polishing of Hard Brittle Materials

Li, J. / Zhu, Y.W. / Zuo, D.W. et al. | British Library Online Contents | 2010

CMP of hard disk substrate using a colloidal SiO2 slurry: preliminary experimental investigation

Lei, H. / Luo, J. | British Library Online Contents | 2004

A study of copper chemical mechanical polishing in urea-hydrogen peroxide slurry by electrochemical impedance spectroscopy

Tsai, T. H. / Wu, Y. F. / Yen, S. C. | British Library Online Contents | 2003