BGA Solder Joints

Kongcharoen, A. / Trongjitwikrai, S. / Netphu, S. | British Library Online Contents | 2002

Study of the undercooling of Pb-free, flip-chip solder bumps and in situ observation of solidification process

Kang, S. K. / Cho, M. G. / Lauro, P. et al. | British Library Online Contents | 2007

Thermomigration in solder joints

Chen, C. / Hsiao, H. Y. / Chang, Y. W. et al. | British Library Online Contents | 2012

Reliability of Solder Joints

Frear, D. R. / Yost, F. G. | British Library Online Contents | 1993

Undercooling, liquid separation and solidification of Cu-Co alloys

Robinson, M. B. / Li, D. / Rathz, T. J. et al. | British Library Online Contents | 1999