Undercooling of Sn-Ag-Cu alloys: solder balls and solder joints solidification: Fid-Bau Portal

Undercooling of Sn-Ag-Cu alloys: solder balls and solder joints solidification

Hodaj, F. / Petit, L. / Baggetto, L. / Boisier, O. / Verneyre, L.

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Undercooling of Sn-Ag-Cu alloys: solder balls and solder joints solidification

Hodaj, F. / Petit, L. / Baggetto, L. / Boisier, O. / Verneyre, L.

Undercooling of Sn-Ag-Cu alloys: solder balls and solder joints solidification

Hodaj, F. / Petit, L. / Baggetto, L. / Boisier, O. / Verneyre, L.

Access

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Check availability in my library

Order at Subito €

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Document information

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Document information

Title:

Undercooling of Sn-Ag-Cu alloys: solder balls and solder joints solidification

Contributors:

Hodaj, F. (author) / Petit, L. (author) / Baggetto, L. (author) / Boisier, O. (author) / Verneyre, L. (author)

Published in:

INTERNATIONAL JOURNAL OF MATERIALS RESEARCH ; 104 ; 874-878

Publication date:

2013-01-01

Size:

5 pages

ISSN:

1862-5282

Type of media:

Article (Journal)

Type of material:

Language:

English

Classification:

DDC: 669.9

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