Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
High Temperature Resistant Packaging for SiC Power Devices Using Interconnections Formed by Ni Micro-Electroplating
High Temperature Resistant Packaging for SiC Power Devices Using Interconnections Formed by Ni Micro-Electroplating
High Temperature Resistant Packaging for SiC Power Devices Using Interconnections Formed by Ni Micro-Electroplating
Kato, N. (Autor:in) / Shigenaga, A. (Autor:in) / Tatsumi, K. (Autor:in) / Okumura, H. / Harima, H. / Kimoto, T. / Yoshimoto, M. / Watanabe, H. / Hatayama, T. / Matsuura, H.
Silicon Carbide and Related Materials 2013 ; 1110-1113
MATERIALS SCIENCE FORUM ; 778/780
01.01.2014
4 pages
Aufsatz (Zeitschrift)
Englisch
DDC:
620.11
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