In situ study on growth behavior of interfacial bubbles and its effect on interfacial reaction during a soldering process: Fid-Bau Portal

In situ study on growth behavior of interfacial bubbles and its effect on interfacial reaction during a soldering process

Qu, L. / Ma, H. T. / Zhao, H. J. / Kunwar, A. / Zhao, N.

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In situ study on growth behavior of interfacial bubbles and its effect on interfacial reaction during a soldering process

Qu, L. / Ma, H. T. / Zhao, H. J. / Kunwar, A. / Zhao, N.

In situ study on growth behavior of interfacial bubbles and its effect on interfacial reaction during a soldering process

Qu, L. / Ma, H. T. / Zhao, H. J. / Kunwar, A. / Zhao, N.

Zugriff

Zugriff über TIB

Verfügbarkeit in meiner Bibliothek prüfen

Bestellung bei Subito €

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Ähnliche Titel

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Dokumentinformationen

Titel:

In situ study on growth behavior of interfacial bubbles and its effect on interfacial reaction during a soldering process

Beteiligte:

Qu, L. (Autor:in) / Ma, H. T. (Autor:in) / Zhao, H. J. (Autor:in) / Kunwar, A. (Autor:in) / Zhao, N. (Autor:in)

Erschienen in:

APPLIED SURFACE SCIENCE ; 305 ; 133-138

Erscheinungsdatum:

01.01.2014

Format / Umfang:

6 pages

ISSN:

0169-4332

Medientyp:

Aufsatz (Zeitschrift)

Format:

Sprache:

Englisch

Klassifikation:

DDC: 621.35

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