Fachinformationsdienst BAUdigital

A platform for research: civil engineering, architecture and urbanism

    In situ study on growth behavior of interfacial bubbles and its effect on interfacial reaction during a soldering process

    New search for: Qu, L.
    New search for: Ma, H. T.
    New search for: Zhao, H. J.
    New search for: Kunwar, A.
    New search for: Zhao, N.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Page navigation

    Document information
    Similar titles

    Export, share and cite

    In situ study on growth behavior of interfacial bubbles and its effect on interfacial reaction during a soldering process

    New search for: Qu, L.
    New search for: Ma, H. T.
    New search for: Zhao, H. J.
    New search for: Kunwar, A.
    New search for: Zhao, N.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    In situ study on growth behavior of interfacial bubbles and its effect on interfacial reaction during a soldering process

    New search for: Qu, L.
    New search for: Ma, H. T.
    New search for: Zhao, H. J.
    New search for: Kunwar, A.
    New search for: Zhao, N.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Page navigation

    Document information
    Similar titles

    Export, share and cite

    Document information
    Title:

    In situ study on growth behavior of interfacial bubbles and its effect on interfacial reaction during a soldering process

    Contributors:

    Qu, L. (author) / Ma, H. T. (author) / Zhao, H. J. (author) / Kunwar, A. (author) / Zhao, N. (author)

    Published in:

    APPLIED SURFACE SCIENCE ; 305 ; 133-138

    Publication date:

    2014-01-01

    Size:

    6 pages

    ISSN:

    0169-4332

    Type of media:

    Article (Journal)

    Type of material:

    Print

    Language:

    English

    Classification:

    DDC:  621.35

    © Metadata Copyright the British Library Board and other contributors. All rights reserved.

    Similar titles

    Metallurgy and Kinetics of Liquid-Solid Interfacial Reaction during Lead-Free Soldering

    Liang, J. / Dariavach, N. / Callahan, P. et al. | British Library Online Contents | 2006

    Impurity and alloying effects on interfacial reaction layers in Pb-free soldering

    Laurila, T. / Vuorinen, V. / Paulasto-Krockel, M. | British Library Online Contents | 2010

    Non-interfacial growth of Cu3Sn in Cu/Sn/Cu joints during ultrasonic-assisted transient liquid phase soldering process

    Zhao, H.Y. / Liu, J.H. / Li, Z.L. et al. | British Library Online Contents | 2017

    Wetting Behavior and Interfacial Reactions in (Sn-9Zn)-2Cu/Ni Joints during Soldering and Isothermal Aging

    Zhao, N. / Ma, H. / Xie, H. et al. | British Library Online Contents | 2009

    In situ study on dissolution and growth mechanism of interfacial Cu6Sn5 in wetting reaction

    Huang, M. L. / Yang, F. / Zhao, N. et al. | British Library Online Contents | 2015

    Back to top