Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Study on planarization machining of sapphire wafer with soft-hard mixed abrasive through mechanical chemical polishing
APPLIED SURFACE SCIENCE ; 389 ; 713-720
01.01.2016
8 pages
Aufsatz (Zeitschrift)
Englisch
DDC:
621.35
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