Pressureless Bonding by Micro-Sized Silver Particle Paste for High-Temperature Electronic Packaging: Fid-Bau Portal

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Pressureless Bonding by Micro-Sized Silver Particle Paste for High-Temperature Electronic Packaging

Roh, Myong-Hoon / Nishikawa, Hiroshi / Tsutsumi, Seiichiro / Nishiwaki, Naruhiko / Ito, Keiichi / Ishikawa, Koji / Katsuya, Akihiro / Kamada, Nobuo / Saito, Mutsuo

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Pressureless Bonding by Micro-Sized Silver Particle Paste for High-Temperature Electronic Packaging

Roh, Myong-Hoon / Nishikawa, Hiroshi / Tsutsumi, Seiichiro / Nishiwaki, Naruhiko / Ito, Keiichi / Ishikawa, Koji / Katsuya, Akihiro / Kamada, Nobuo / Saito, Mutsuo

Pressureless Bonding by Micro-Sized Silver Particle Paste for High-Temperature Electronic Packaging

Roh, Myong-Hoon / Nishikawa, Hiroshi / Tsutsumi, Seiichiro / Nishiwaki, Naruhiko / Ito, Keiichi / Ishikawa, Koji / Katsuya, Akihiro / Kamada, Nobuo / Saito, Mutsuo

Zugriff

Zugriff über TIB

Verfügbarkeit in meiner Bibliothek prüfen

Bestellung bei Subito €

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Dokumentinformationen

Ähnliche Titel

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Dokumentinformationen

Titel:

Pressureless Bonding by Micro-Sized Silver Particle Paste for High-Temperature Electronic Packaging

Beteiligte:

Roh, Myong-Hoon (Autor:in) / Nishikawa, Hiroshi (Autor:in) / Tsutsumi, Seiichiro (Autor:in) / Nishiwaki, Naruhiko (Autor:in) / Ito, Keiichi (Autor:in) / Ishikawa, Koji (Autor:in) / Katsuya, Akihiro (Autor:in) / Kamada, Nobuo (Autor:in) / Saito, Mutsuo (Autor:in)

Erschienen in:

Materials transactions ; 57 ; 1209-1214

Erscheinungsdatum:

01.01.2016

Format / Umfang:

6 pages

ISSN:

Medientyp:

Aufsatz (Zeitschrift)

Format:

Print

Sprache:

Englisch

Klassifikation:

© Metadata Copyright the British Library Board and other contributors. All rights reserved.

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