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Surface integrity and removal mechanism of silicon wafers in chemo-mechanical grinding using a newly developed soft abrasive grinding wheel
Surface integrity and removal mechanism of silicon wafers in chemo-mechanical grinding using a newly developed soft abrasive grinding wheel
Surface integrity and removal mechanism of silicon wafers in chemo-mechanical grinding using a newly developed soft abrasive grinding wheel
Gao, Shang (author) / Huang, Han (author) / Zhu, Xianglong (author) / Kang, Renke (author)
Materials science in semiconductor processing ; 63 ; 97-106
2017-01-01
10 pages
Article (Journal)
English
DDC:
621.38152
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