Non-interfacial growth of Cu3Sn in Cu/Sn/Cu joints during ultrasonic-assisted transient liquid phase soldering process: Fid-Bau Portal

Non-interfacial growth of Cu3Sn in Cu/Sn/Cu joints during ultrasonic-assisted transient liquid phase soldering process

Zhao, H.Y. / Liu, J.H. / Li, Z.L. / Zhao, Y.X. / Niu, H.W. / Song, X.G. / Dong, H.J.

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Non-interfacial growth of Cu3Sn in Cu/Sn/Cu joints during ultrasonic-assisted transient liquid phase soldering process

Zhao, H.Y. / Liu, J.H. / Li, Z.L. / Zhao, Y.X. / Niu, H.W. / Song, X.G. / Dong, H.J.

Non-interfacial growth of Cu3Sn in Cu/Sn/Cu joints during ultrasonic-assisted transient liquid phase soldering process

Zhao, H.Y. / Liu, J.H. / Li, Z.L. / Zhao, Y.X. / Niu, H.W. / Song, X.G. / Dong, H.J.

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Check availability in my library

Order at Subito €

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Document information

Title:

Non-interfacial growth of Cu3Sn in Cu/Sn/Cu joints during ultrasonic-assisted transient liquid phase soldering process

Contributors:

Zhao, H.Y. (author) / Liu, J.H. (author) / Li, Z.L. (author) / Zhao, Y.X. (author) / Niu, H.W. (author) / Song, X.G. (author) / Dong, H.J. (author)

Published in:

MATERIALS LETTERS ; 186 ; 283-288

Publication date:

2017-01-01

Size:

6 pages

ISSN:

0167-577X

Type of media:

Article (Journal)

Type of material:

Language:

Unknown

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Li, Z. W. / Li, X. H. / Tao, X. J. et al. | British Library Online Contents | 2012

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Chiu, Wei-Lan / Liu, Chien-Min / Haung, Yi-Sa et al. | British Library Online Contents | 2016