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Quantitative analysis of nano-defects in thin film encapsulation layer by Cu electrodeposition
Quantitative analysis of nano-defects in thin film encapsulation layer by Cu electrodeposition
Quantitative analysis of nano-defects in thin film encapsulation layer by Cu electrodeposition
Chu, Kunmo (Autor:in) / Bae, Ki Deok (Autor:in) / Song, Byong Gwon (Autor:in) / Kim, Jaekwan (Autor:in) / Park, Yong Young (Autor:in) / Xianyu, Wenxu (Autor:in) / Lee, Chang Seung (Autor:in) / Sohn, Yoonchul (Autor:in)
Applied surface science ; 453 ; 31-36
01.01.2018
6 pages
Aufsatz (Zeitschrift)
Englisch
DDC:
620.44
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